Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap Fillers

Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap Fillers provide high thermal conductivity, low thermal resistance, and high reliability. These gap fillers minimize the bonding force between the components and heatsink during disassembly, which makes it easy to rework. The CR350S gap fillers' 1:1 mix is easily dispensable through a wide variety of dispensing equipment. These gap fillers feature a 3.6W/mK thermal conductivity and meet ROHS and REACH requirements. The A+B putty material cures in place after dispensing and mixing to perfectly fill the gap. Typical applications include automotive, graphics chips, microprocessors, and telecom base stations.

Features

  • Dispensable and compliant
  • Easily reworkable
  • Ideal for large gaps
  • Meet ROHS and REACH requirements

Specifications

  • Yellow/white color
  • 3.6W/mK thermal conductivity
  • 3.15g/cc density
  • 85µm minimum bond line thickness
  • 7kVAC dielectric breakdown voltage at 1mm
  • 2.9 x 1014Ωcm volume resistivity
  • -55°C to 200°C operating temperature range

Applications

  • Automotive
  • Graphic chips
  • Microprocessors
  • Telecom base stations

Curing Profile

Performance Graph - Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap Fillers
Inilathala: 2025-07-09 | Na-update: 2025-09-09