Laird Technologies Tpcm™ 7000 High-Performance TIMs

Laird Technologies Tpcm™ 7000 High-Performance Thermal Interface Material (TIM) enhances the cooling of the rigorous thermal challenges in electronics. These TIMs feature a thermal conductivity of 7.5W/mK and provide the lowest thermal resistance by coupling with superior wetting of the mating surfaces and displacing air. Other features are a non-silicone formulation that provides a naturally tacky surface, -40°C to +125°C operating temperature range, and long-term reliability. Within a temperature range of +50°C to +70°C, the initial pad thickness can decrease to a bondline as thin as 35µm. Laird Tpcm 7000 TIMs reliability is shown through exposure to 2000hrs of various aging tests, resulting in proven dependability of +150°C operating temperature. Typical applications include graphic cards, desktops, servers, IGBTs, automotive, memory modules, and game consoles.

Features

  • 7.5W/mK bulk thermal conductivity
  • Easy application and automation
  • Non-silicone formulation that provides a naturally tacky surface
  • An environmentally friendly solution that meets regulatory requirements
  • Bondline as thin as 35µm once softened (+50°C to +70°C)
  • Easy rework
  • No pump-out
  • Long-term reliability
  • Fully characterized long-term reliability
  • Environmentally friendly solution
  • RoHS and REACH compliant

Applications

  • Graphics card
  • Desktops
  • Servers
  • IGBTs
  • Automotive
  • Memory modules
  • Game consoles

Specifications

  • Temperature ranges
    • -40°C to +125°C operating
    • +50°C to +70°C softening
  • 35µm minimum bondline thickness
  • 0.13mm, 0.2mm, 0.25mm, and 0.4mm thickness options
  • 31.54 dielectric constant at 1MHz
  • 5.4x1015Ω-cm volume resistivity
  • 7.5W/m-K bulk thermal conductivity
  • 2.5g/cc density
  • 1-year shelf life from date of shipment in a sealed bag

Videos

Inilathala: 2022-07-29 | Na-update: 2025-06-17