NXP Semiconductors i.MX 8ULP Crossover Applications Processors
NXP Semiconductors i.MX 8ULP Crossover Applications Processors brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. EdgeLock secure enclave is pre-configured to simplify complex security implementations. The i.MX 8ULP devices feature NXP’s Energy Flex architecture that combines heterogeneous domain computing, design techniques, and process technology. A dedicated power management subsystem offers more than twenty power mode combinations to deliver exceptional efficiency across various applications.The NXP Semiconductors i.MX 8ULP applications processors offer up to two Arm® Cortex®-A35 running at 800MHz, an Arm Cortex-M33 core, 3D/2D Graphics Processing Units (GPUs), and a Cadence® Tensilica® Hifi 4 DSP and Fusion DSP for low-power audio/voice and edge AI/ML processing.
Features
- CPU
- Up to two Arm® Cortex®-A35 at 800MHz
- Arm Cortex-M33 at 216MHz
- Cadence® Tensillica® Hifi 4 DSP at 475MHz for advanced audio, voice, and ML processing and Fusion DSP at 200MHz for low-power voice/sensor hub processing
- EdgeLock™ secure enclave
- RISC-V powered Power Management Subsystem (µpower)
- 896KB total on-chip SRAM memory
- External memory
- LPDDR3/LPDDR4/LPDDR4X
- SPI-NOR
- SPI-NAN
- Graphics
- 3D GPU includes Open GL® ES 3.1, OpenCLTM, and Vulkan®
- 2D GPU
- 1x MIPI DSI (4-lane) with PHY with up to 24-bit RGB (DBI/DPI)
- Color EPD display
- Connectivity
- 10/100 Ethernet
- FlexCAN
- 1x MIPI CSI (2-lane) display/camera with PHY
- Packages
- 9.4mm2 FCCSP
- 15mm2 MAPBGA
- -40°C to +85°C/+105°C temperature range
Applications
- Smart home controls
- Wearables
- IoT edge solutions
- Portable patient monitoring
- Building automation
- Portable scanners and printers
- e-Readers
- EV wall chargers
- Medical devices
- Base station control equipment
Block Diagram
Additional Resources
Inilathala: 2023-08-01
| Na-update: 2024-07-24
