Infineon Technologies Flash+RAM MCP Solutions
Infineon Technologies Flash+RAM MCP Solutions are for systems that require flash and RAM, implementing Infineon's multi-chip package (MCP) solutions to simplify overall system design. MCP products integrate both memories into a single package, decreasing the BOM, lowering the pin count, and reducing PCB size and layer requirements. The Flash+RAM MCP Solutions supply performance and quality into one space-saving package.
The Infineon Flash+RAM MCP Solutions Gen 2 improves on HYPERBUS™ MCP (the prior generation) with increased performance and reliability. The MCP Gen 2 upgrades from HYPERFLASH™ to SEMPER™ NOR Flash and from HYPERRAM™ 1.0 to HYPERRAM 2.0. MCP Gen 2 also extends chipset support by adding an Octal interface option.
Features
- Density configuration of 512Mb Flash + 64Mb RAM
- Interface:
- Octal (xSPI Profile 1)
- HYPERBUS™ (xSPI Profile 2)
- Performance of 400MB/s read bandwidth
- 1.8V or 3.0V voltages
- -40°C to +105°C Automotive Grade 2 temperature range
- 24-ball BGA (8mm x 8mm) package
Applications
- Dashboard
- Infotainment
- HMI
Inilathala: 2023-09-11
| Na-update: 2025-10-23