Texas Instruments SMALL-AMP-DIP Evaluation Module
Texas Instruments SMALL-AMP-DIP Evaluation Module speeds up small package op-amp prototyping by providing a fast and easy interface with many industry-standard small-size packages. The Texas Instruments SMALL-AMP-DIP-EVM supports eight small package options, including DPW-5 (X2SON), DSG-8 (WSON), DCN-8 (SOT), DDF-8 (SOT), RUG-10 (X2QFN), RUC-14 (X2QFN), RGY-14 (VQFN), and RTE-16 (WQFN).
Features
- Simplifies prototyping of small package ICs
- Supports eight small package types
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