STMicroelectronics Powers Euro 7 Testing with Molex & Bourns
Euro 7 [or Regulation (EU) 2024/1257] introduces advanced emissions testing requirements in 2027. These include real-driving emissions (RDE), particle number detection at 10 nanometres, and detailed analysis of pollutants such as NOX, PM, NH3, and CO2. Non-exhaust sources, such as brake and tire abrasion, add even more complexity, making compliance a serious challenge.
The answer lies in precision and reliability. Advanced test cell equipment and onboard systems for RDE measurement are essential, supported by portable emissions measurement systems and exhaust gas analyzers capable of detecting ultra-fine particles. To make this possible, engineers rely on technologies that deliver real-time control, accurate particulate measurement, and secure data transfer.
With the right technology from STMicroelectronics, Bourns, and Molex, engineers can turn complexity into confidence and achieve Euro 7 compliance efficiently.
Features
- Automotive-grade microcontrollers and power management ICs ensure deterministic sensing, precise time stamping, and robust communications during fast transients
- Precision passives and circuit protection deliver accurate results from sensors and signal chains by safeguarding them from electrical noise, thermal drift, and transient events
- Robust connectors ensure seamless communication between sensors and test equipment, protecting data integrity throughout the process
Applications and Series
- STMicroelectronics Stellar E1 synchronizes high-rate sensor data and communications in real time, maintaining stable time stamping and low latency through transients for measurement accuracy
- STMicroelectronics DCP0606Y ensures stable power delivery to sensors and controllers throughout demanding Euro 7 test procedures
- Bourns SRP3220A Shielded Power Inductors reduce switching noise and stabilise power lines in high‑frequency front ends and sensor interfaces
- Bourns TBU‑CA‑Q AEC-Q101 TBU® High‑Speed Protectors provide rapid overcurrent isolation for RDE sensors and communication lines to prevent faults and errors during frequent field reconnections
- Molex High-Speed FAKRA-Mini (HFM) Interconnect System enables high-speed data transmission between sensors and test equipment for reliable emissions reporting
- Molex DuraClik Wire-to-Board Connectors provide secure wire-to-board connections for sensor integration in harsh automotive environments
- Molex MX150 Automotive Connectors offer robust connectivity for power and signal integrity during Euro 7 compliance testing
Featured Products
STMicroelectronics SR5E1x Stellar E 32-bit Automotive MCUs
Designed to meet the enhanced digital control and high-performance analog for EV vehicles.
STMicroelectronics DCP0606Y Automotive 6V/6A Step-Down Converter
High-efficiency, monolithic step-down converter specifically designed for automotive applications.
Bourns SRP3220A Shielded Power Inductors
AEC-Q200 compliant and offers low buzz noise, high current, and low DC resistance (DCR).
Bourns TBU-CA-Q AEC-Q101 TBU® High-Speed Protectors
AEC-Q101-compliant low-capacitance single bidirectional high-speed protection components.
Molex High-Speed FAKRA-Mini (HFM) Interconnect System
Compact, high-performance solution tailored for the demands of modern vehicle architectures.
Molex DuraClik Wire-to-Board Connectors
2.0mm pitch, provides superior electrical contact reliability, mating retention, and space savings.
Molex MX150 Automotive Connectors
Offers sealed connectors and unsealed connectors to simplify the assembly processes.