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Bench Talk for Design Engineers

Bench Talk

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Bench Talk for Design Engineers | The Official Blog of Mouser Electronics


Designing Connectors for Data Centers Amphenol
Amphenol FCI PCIe Gen 5 Flip CEM connector combines the standard PCIe interface with next-generation performance for the latest data center applications. Innovative contact design simplifies compact PCB design and helps with thermal management challenges.

Power Connectors for Data Centers and Beyond David Pike
Data centers pose challenges in power distribution that highlight the importance of power density. Examine connector designs that meet growing data center demands for efficiency, performance, and space optimization.

How Connectors Enable the AI Revolution David Pike
Artificial intelligence and machine learning rely on advanced computing and massive data processing. This reliance underscores the critical role connectors play in maintaining signal integrity and efficient power management.

Connecting Sensors for Oil-Cooled Motors in Electric Vehicles Molex
Electric vehicles need advanced thermal management. Oil cooling has become the dominant technology for EV motor cooling and is also being applied to batteries and power electronics. Molex provides the pass-through connectors that designers need for these latest cooling technologies.

New Tech Tuesdays: How Thermal Management Keeps Devices, Circuits from Losing Their Cool Tommy Cummings
In this week's New Tech Tuesday, we'll look at products that keep things cool from NMB Technologies, Laird, and Texas Instruments.

IndyCars Designed to Handle Harsh Environments Doug Brown
Each IndyCar race has its unique challenges, but harsh environment problems are present throughout the season. This is a look at some of the harsh environmental conditions teams must overcome to have a safe and successful race.

Are Your Selfies Really Cool? Lucas Benson
Demand for data storage is growing exponentially, fueled by everything from storing selfies to company sales figures. Data center priorities are switching to lower power and cooling to handle the increased processing density.

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