XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.

Mga Resulta: 19
Pumili Larawan # ng Piyesa Mfr. Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami. Dami RoHS ECAD Model Produkto Dami ng Posisyon Dami ng Row Pitch Istilo ng Termination Plating ng Contact Series Packaging
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 64May Stock
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 48May Stock
Min.: 1
Mult.: 1

Headers 24 Position 4 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 66May Stock
Min.: 1
Mult.: 1

Headers 36 Position 6 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 38May Stock
Min.: 1
Mult.: 1

Headers 36 Position 6 Row 1.8 mm Press Fit Gold Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 121May Stock
Min.: 1
Mult.: 1

Headers 48 Position 8 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 38May Stock
Min.: 1
Mult.: 1

Headers 32 Position 4 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 60May Stock
Min.: 1
Mult.: 1

Headers 48 Position 6 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 103May Stock
Min.: 1
Mult.: 1

Headers 64 Position 8 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 14May Stock
Min.: 1
Mult.: 1

Headers 96 Position 8 Row 1.8 mm Solder Pin HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header 498Available ang Stock ng Pabrika
Min.: 1
Mult.: 1

Headers 96 Position 8 Row 1.8 mm Press Fit Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 2 (na) Linggo
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 3 (na) Linggo
Min.: 1
Mult.: 1

Headers 4 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 8 (na) Linggo
Min.: 1
Mult.: 1

Headers 6 Row 1.8 mm Solder Pin Gold HDTM Tray
Samtec High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header Lead-Time para sa Hindi Naka-stock 12 (na) Linggo
Min.: 1
Mult.: 1

Headers 8 Row 1.8 mm Solder Pin Gold HDTM Tray