Sterling LWB+ Development Kits

Ezurio Sterling LWB+ Development Kits are designed to quickly demonstrate the functionality and versatility of the Sterling LWB+ Wi-Fi® 4 and BLUETOOTH® 5.2 Modules. The Sterling LWB+ Wi-Fi 4 and Bluetooth 5.2 Modules are based upon the Infineon AIROC™ CYW43439 chipset. The Sterling LWB+ Modules are a System-in-Package (SIP) with two certified module versions, supporting either an onboard chip antenna or an MHF connector for an external antenna. The Sterling LWB+ is intended to meet medical and industrial IoT connectivity requirements.

Mga Resulta: 2
Pumili Larawan # ng Piyesa
 Mfr.
Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami.
Dami RoHS Produkto
Frequency
Ang Tool Ay Para Sa Pagsusuri Ng
Supply Voltage ng Pagpapatakbo
Uri ng Interface
Minimum na Operating Temperature
Maximum na Operating Temperature
Protocol - Bluetooth, BLE - 802.15.1
Protocol - WiFi - 802.11
Ezurio Multiprotocol Development Tools Sterling LWB+, Chip Antenna, Dev Kit CYW43439
Datasheet
2May Stock
Min.: 1
Mult.: 1

Development Kits 2.4 GHz 453-00085R, 453-00085C 3.3 V SDIO, UART - 40 C + 85 C Bluetooth 5.2 WiFi 4, 802.11 b/g/n
Ezurio Multiprotocol Development Tools Sterling LWB+, MHF4, Dev Kit CYW43439
Datasheet
Lead-Time para sa Hindi Naka-stock 20 (na) Linggo
Min.: 1
Mult.: 1

Development Kits 2.4 GHz 453-00084R, 453-00084C 3.3 V SDIO, UART - 40 C + 85 C Bluetooth 5.2 WiFi 4, 802.11 b/g/n