3.3 V Mga Module ng Cellular

Mga Resulta: 38
Pumili Larawan # ng Piyesa
 Mfr.
Paglalarawan Datasheet Availability Pagpepresyo (PHP) I-filter ang mga resulta sa talahanayan ayon sa unit price batay sa iyong dami.
Dami RoHS ECAD Model Series
Frequency
Output Power
Uri ng Interface
Supply Voltage - Min
Supply Voltage - Max
Tina-transmit na Supply Current
Tinatanggap na Supply Current
Minimum na Operating Temperature
Maximum na Operating Temperature
Uri ng Antenna Connector
Mga Dimensiyon
Protocol - Cellular, NBIoT, LTE
Packaging
Telit Cinterion Cellular Modules Hindi Naka-stock
Min.: 90
Mult.: 90

USB 3.1 V 3.6 V - 40 C + 85 C 42 mm x 30 mm x 2.4 mm LTE Tray
Telit Cinterion Cellular Modules Hindi Naka-stock
Min.: 90
Mult.: 1

USB 3.1 V 3.6 V - 40 C + 85 C 42 mm x 30 mm x 2.4 mm LTE Tray
Telit Cinterion Cellular Modules MV32-W-A ext Dual SIM
Datasheet
Hindi Naka-stock
Min.: 50
Mult.: 50
USB - 40 C + 85 C MHF 30 mm x 42 mm x 2.6 mm LTE, 5G Tray
Telit Cinterion LN920A06W04T041400
Telit Cinterion Cellular Modules Lead-Time para sa Hindi Naka-stock 10 (na) Linggo
Min.: 90
Mult.: 90

USB 3.1 V 3.6 V - 40 C + 85 C 42 mm x 30 mm x 2.4 mm LTE Tray
u-blox Cellular Modules LTE/HSPA+/GSM module for Softbank (JP) Cat 4, B1, B3, B5, B7, B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Hindi Naka-stock
Min.: 160
Mult.: 160

1.9 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Cellular Modules LTE Cat 4 only; Japan/NTT docomo LTE: 1,3,5,8,19 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Hindi Naka-stock
Min.: 160
Mult.: 160

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Cellular Modules LTE/HSPA+/GSM module LTE:B1,B3,B5,B7,B8,B28; 3G :B1,B2,B5,B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Hindi Naka-stock
Min.: 160
Mult.: 160

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
Quectel Cellular Modules Cat 1 + 3G + 2G module
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Cellular Modules CAT 1
Datasheet
Hindi Naka-stock
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Cellular Modules Cat 1, 4Gbit ROM+2Gbit RAM, South Korea only
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Cellular Modules Cat 1, mPCIe form factor, South Korea
Datasheet
Lead-Time para sa Hindi Naka-stock 26 (na) Linggo
Min.: 100
Mult.: 100
: 100

33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V 32 mA - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Reel
Quectel Cellular Modules CAT 1
Datasheet
Hindi Naka-stock
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Cellular Modules Cat 1, 4Gbit ROM+2Gbit RAM, Verizon (NA)
Datasheet
Lead-Time para sa Hindi Naka-stock 24 (na) Linggo
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape