Bench Talk

Bench Talk for Design Engineers | The Official Blog of Mouser Electronics

Wi-Fi® 5 + Bluetooth® 5.2 Combo Wireless Modules for IIoT Connectivity

On Hulyo 2, 2021 in All, IoT, Wireless by Paul Golata

Laird Connectivity and Infineon Technologies are the perfect combination to help with designing Wi-Fi 5 (802.11ac) + Bluetooth into your next-generation wireless product. Laird Connectivity’s Sterling-LWB5+ wireless module hosts the AIROC™ CYW4373E Dual-Band 802.11ac + Bluetooth 5.2 SoC and provides customers an easy path to production.

Tagged With: 802.11ac, bluetooth , cypress, infineon technologies, laird connectivity, wi-fi

USB-C Becomes Standard For Power Delivery

On Hunyo 12, 2019 in All, Connectors, Power by Robert Huntley

Need to update your product and replace the legacy barrel power connector? Discover how you can transition your device designs using a simple, no-firmware, highly integrated, and USB-IF-certified method from Cypress and Molex.

Tagged With: barrel connector replacement, BCR, CYPD3177, Cypress, Cypress BCR Controller, Cypress CY4533, Cypress EZ-PD, Molex, Molex USB Type C connectors and cables, USB cable, USB PD, USB power delivery, USB Type C, USB Type-C, USB Type-C plug, USB Type-C receptacle, USB-C, USB-IF

Bluetooth® mesh & Home Automation

On Mayo 10, 2019 in All, Automation, IoT by Robert Huntley

Bluetooth® mesh networking promises to accelerate home automation design and deployment. This blog explores the basics of Bluetooth mesh and describes how Cypress is well-equipped with the products, development tools, and source code examples to help speed your design.

Tagged With: Android, Apple iOS, BLE, Bluetooth, Bluetooth 5, Bluetooth mesh, CYBT-213043-MESH, Cypress, IoT, Mesh network, Microsoft Windows

New Ultra-Low-Power Benchmark

On Hunyo 4, 2014 in Low Power by John Donovan

As an editor I’ve been on the receiving end of a lot of specmanship, which is why I always look to datasheets, though meaningful comparisons of seemingly similar MCUs between different vendors are hard to construct, especially since overall energy consumption is so application specific. As Markus Levy of the Embedded Microprocessor Benchmark Consortium (EEMBC) remarked to me last week, “Datasheets don’t lie, they just present [information] the way they want to present it.”

Tagged With: ADC, ADI, ARM, Atmel, Cypress, datasheets, DTC, EEMBC, Freescale, MCU, Microchip, RAM, Renesas, RTCC, Silicon Labs, Spansion, STMicroelectronics, Texas Instruments, ULPBench

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