Amphenol FCI Flexible Printed Circuit Assemblies
Amphenol FCI Flexible Printed Circuit (FPC) Assemblies are board-to-board solutions that offer a flexible option for space-constrained environments where PCBs are not an option. These assemblies have a comprehensive range of pitch sizes, positions, and stack heights, ensuring all needs are satisfied. FPC assemblies feature high-speed performance up to 16Gb/s and utilize SMT processes with higher process consistency. Amphenol FCI FPC Assemblies are suitable for various applications, including automotive, communication, consumer, medical, and industrial.
Features
- Flexible option for space-constrained environments where PCBs are not an option
- High-speed performance up to 16Gb/s
- Comprehensive range of pitch sizes, positions, and stack heights to satisfy all needs
- Utilizes SMT process with higher process consistency
Applications
- Automotive
- Communications
- Consumer
- IT/DA
- Industrial and instrumentation
- Medical
Specifications
- 0.3A to 20A current rating per contact
- 1000MΩ minimum insulation resistance
- 20mΩ maximum LLCR
- Copper alloy terminal
- UL 94V-0 thermoplastic LCP housing
- 30 to 200 cycles of durability
- MIL-STD-202, method 201 or USCAR2 V2 vibration
- -55°C to +125°C operating temperature range
Featured Products
Amphenol FCI BergStak® FPC Jumpers
Board-to-board solutions that provide mating reliability and high design flexibility.
Amphenol FCI MezzoStak® Flexible Printed Circuit Assembly
Features 30 positions, a 2mm height, and a 100mm cable with gold flash tail plating.
Amphenol FCI Conan® Flexible Printed Circuit Assembly
Features 31 positions, 4.5mm height, and 200mm cable with 100μ" minimum tin tail plating.
Additional Resources
Inilathala: 2024-04-05
| Na-update: 2024-04-12