STMicroelectronics CAM-55G0 Promodules

STMicroelectronics CAM-55G0 Promodules are sample camera modules made for seamless evaluation and integration of the VD55G0 0.38-megapixel monochrome image sensor. The ready-to-use vision extensions integrate a VD55G0 image sensor, lens holder, lens, and plug-and-play flex connection in a tiny format down to 5.0mm². The CAM-55G0 leverages the complete toolbox of on-chip features of the embedded VD55G0 image sensor, such as autoexposure or context management. Multiple GPIOs enable users to synchronize the modules with triggers and illumination. Featuring a single-lane MIPI CSI-2 output, the promodules are ideally suited for embedded low-power setups.

The STMicroelectronics promodule references feature various lenses to match the needs of every application in terms of optical setup and mechanical constraints. All camera modules are equipped with the same FPC-to-board connector and pinout. The plug-and-play architecture allows users to change promodules instantly and reuse the same setup with different lenses, color options, and even different image sensors in the ST BrightSense portfolio.

CAM-55G0 promodules can be tested and integrated on computers or embedded processing boards using hardware and software tools from STMicroelectronics. The compatible EVK Main and P-Board hardware kits enable straight connection to a PC and embedded processing platforms respectively. Evaluation GUI software and Linux drivers are available for download.

Features

“Promodules” turnkey camera modules for evaluation:
- Including a VD55G0 image sensor, lens holder, lens, and plug-and-play flex connection
- Lens focused, glued, and tested in a cleanroom environment using specialized equipment
- Small footprint down to 5.0mm²
Various lens options
- Ultra-wide-angle lens for wide scene capture (158° DFOV)
- General purpose lens enabling various system setups (79° DFOV) and a thin design

Plug-and-play connector to change the promodules at any time
- FPC-to-board 30-pin connector
- Same connector for all ST promodules
Ready for evaluation and integration
- On a computer with a USB output using the EVK Main hardware tool and the free Evaluation GUI software
- On embedded processing platforms with a MIPI CSI-2 output using the P-Board hardware tool and free Linux software tools

Applications

Engineered for high-performance computer vision applications, including AR/VR, personal/industrial robotics, drones, barcodes, biometrics and gestures, embedded vision, or scene recognition.
Typical use cases where high-performance near IR sensing is key
Demanding computer vision on scene with movement requiring no shutter artifacts

Specifications

Image characteristics
- VD55G0 sensor
- 0.38MP resolution, 644 x 604
- Close to 1:1 aspect ratio
- Global shutter type
- Monochrome color option
Electrical characteristics
- FPC-to-board connector type
- Hirose BM28 B0.6-30DP/2-0.35V connector reference
- 30-pins
- MIPI CSI-2, one-lane output interface
- I²C control interface
- RAW8 and RAW10 output format
- 2.8V to 1.8V to 1.15V supply voltages
- 6MHz to 27MHz external clock frequency
Optical characteristics
- CAM-5G0-079CLR
  - 79° D, 62° H, and 59° V field of view
  - 1.348mm EFL
  - 20cm -> ∞ depth of field
  - <1% TV distortion
- CAM-5G0-158CLR
  - 158° D, 116° H, and 108° V field of view
  - 0.825mm EFL
  - 40cm -> ∞ depth of field
  - <37% TV distortion
- F/2.0 aperture (f/#)
- Clear filter

Mechanical characteristics
- CAM-5G0-079CLR
  - 5.0mm x 5.0mm x 2.85mm (LxWxH) module head dimensions
  - 11.6mm x 8.0mm x 2.85mm (LxWxH) module total dimensions
- CAM-5G0-158CLR
  - 7.0mm x 7.0mm x 5.78mm (LxWxH) module head dimensions
  - 12.65mm x 8.0mm x 5.78mm (LxWxH) module total dimensions
- 7.45mm distance from the connector to the optical center
Embedded
- Image quality optimization
  - Autoexposure
  - Automatic dark calibration
  - Defective pixel correction
  - Analog and digital gains
- Power and data optimization
  - Cropping
  - Binning
  - Subsampling
  - Context management with up to four contexts
- Mirror/flip
- Test pattern generation
- Temperature sensor
- 4x GPIOs